Extended incident-angle dependence formula of physical sputtering

T.Ono, K.Shibata, T.Kenmotsu, T.Muramoto, Z.Li and T.Kawamura

Sputtering; Erosion; Plasma–materials interaction; First wall materials
Low-energy sputtering is studied through molecular dynamics (MD) and binary-collision approximation (BCA) simulations. First, MD simulations as a preliminary study are performed for 5 keV Ar impacts on a Cu target. When random numbers gave the direction of the target crystal axis for each impact, the total sputtering yield almost agreed with the experimental yield of a polycrystalline Cu target. Second, we performed MD and BCA simulations for self-sputtering of W with an incident energy of 100 eV and incident angles of 0°–85°. We found that the many-body collision results in high-yield sputtering at grazing incidence. The incident angle dependence of sputtering yields fade out for an MD result with a rough surface.
17th International Conference on Plasma Surface Interactions

Journal of Nuclear Materials

Elsevier

363-365

1266

1271