Patents

Basic information

Name Nakamura Osamu
Belonging department
Occupation name
researchmap researcher code B000300963
researchmap agency Okayama University of Science

Name

接合基板及び接合方法

Author

中村 修  田中 幸一 野村 雅俊 

ApplicationID

2006-63735

ApplicationDate

2006/03

PublicID

PublicDate

TranslationID

TranslationDate

PatentID

特許4449926

Date of issue

2010/02

ApplicationPerson

J-GLOBAL ID

Summary

URL