Patents

Basic information

Name Nakamura Osamu
Belonging department
Occupation name
researchmap researcher code B000300963
researchmap agency Okayama University of Science

Name

Junction substrate and method of bonding substrates together

Author

Osamu Nakamura, Tsutomu Terazaki, Keishi Takeyama

ApplicationID

CA 2509912

ApplicationDate

2004/08

PublicID

PublicDate

TranslationID

TranslationDate

PatentID

CA2509912 C

Date of issue

2009/02

ApplicationPerson

J-GLOBAL ID

Summary

URL