Patents

Basic information

Name Nakamura Osamu
Belonging department
Occupation name
researchmap researcher code B000300963
researchmap agency Okayama University of Science

Name

接合基板及び接合方法

Author

中村 修

ApplicationID

2005-272101

ApplicationDate

2005/09

PublicID

PublicDate

TranslationID

TranslationDate

PatentID

特許5320657

Date of issue

2013/07

ApplicationPerson

J-GLOBAL ID

Summary

URL