Patents

Basic information

Name Nakamura Osamu
Belonging department
Occupation name
researchmap researcher code B000300963
researchmap agency Okayama University of Science

Name 

Junction substrate and method of bonding substrates together

					

					

						

							

								

									
Author 

									
								

							

						

						
Osamu Nakamura, Keishi Takeyama, Tsutomu Terazaki

					

					

						

							

								

									
ApplicationID 

									
								

							

						

						
US 11/677,859

					

					

						

							

								

									
ApplicationDate 

									
								

							

						

						
2007/02

					

					

						

							

								

									
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PatentID 

									
								

							

						

						
US7867346 B2

					

					

						

							

								

									
Date of issue 

									
								

							

						

						
2011/01

					

					

						

							

								

									
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Summary 

									
								

							

						

						

					

					

						

							

								

									
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